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DS VARIATION highLINE

For all die sorting applications

DS VARIATION highLINE  is an innovation that leads you to new applications in the Semiconductor world - a platform solution providing highest quality control on the chips to be handled as well as possibilities for placing them onto the package as needed. This ultra flexible system picks up chips from the wafer where the flip or non-flip mode can be chosen by simply pushing a software button. The chips are placed into the carrier, e.g. Waffle Pack/Gel Pack, Jedec tray, film frame, glass tool, lead frame, carrier tape or other defined carriers. A 100 % quality control on each process step is included and a 6-side inspection with ultra high resolution can be integrated optionally. The DS VARIATION offers the perfect solution for your needs with both, benefits in high volume multi bin sorting as well as the capability to cover a whole range of niche applications.

Just select your suitable output configuration!

KEY FEATURES

  • „ALL in ONE“ solution can pick from and place in:
    • Tape and Reel
    • Waffle Pack
    • Jedec Tray
    • Reconstructed wafer
    • Tape to tape
  • Throughput up to 10,000 dies/hour with flip
  • Multi Bin Capability (2x T&R)
  • Flexible output configuration with 2 indexer
  • Both sorting modes are available: flip and non-flip

Mühlbauer Group
Josef-Mühlbauer-Platz 1
93426 Roding Germany

Phone: +49 9461 952 0
Fax: +49 9461 952 1101

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