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The All In One Solution for IC Module Production

The flip chip IC module production system combines all single process steps in only one single machine. Starting from glue dispensing through to high accuracy flip chip die attach to final bonding, followed by optical and electrical quality control as well as bad unit reject punching - just one machine is completing the whole IC module assembly. Neither wire bonding nor encapsulation is required, which makes flip chip IC module production very cost-competitive.

MÜHLBAUER'S FLIP CHIP IC MODULE PRODUCTION SYSTEM

FCM 10000

  • High speed flip chip mounting of up to 9,500UPH
  • High placement accuracy of ±20μm
  • A compact production and high speed inspection line for IC modules
  • Both optical and electrical quality control of the finished product
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