CME 3060
Chip Module Encapsulation
The CME 3060 represents a new generation of high speed chip module encapsulation equipment. While concentrating on 100% INLINE PROCESS CONTROL the machine also features 50% more curing capacity compared to other systems.
Based on the new dosing head design program with 16-fold encapsulation and improvements in terms of quality and maintenance friendliness, an easy and quick recipe creation is now possible. CME 3060 can work with thermal-, UV and even an LED UV curing station. The LED UV curing system requires significantly less space while having more power (compared to standard UV discharge lamps) thus enabling high speed production. In order to guarantee best output quality control, the Tape Inspection process of TI 2280 can be integrated inline. The TI 2280 controls the thickness or optically inspects the front and back side. It is even possible to integrate an electrical test station to get completely finished modules ready for shipment.
NEW on CME 3060
- New 16-fold dosing head V66
- New 16-fold membrane dosing head V60
- Purging stations for dosing heads in stop or standby mode
- Inline process control to monitor the encapsulation of all nozzles
- CNC programming software for easy dosing layout creation
- 100% process control through vision systems
- Visualization cameras for accurate dosing head adjustment
DESIGN
- Automatic spooling systems for 35 mm reel-to-reel module tapes and spacer tapes incl. reverse mode
- Automatic tape indexing system
- Vacuum fixing of the tape at dispensing positions
- Tandem dosing head for Dam&Fill or Dual Glob Top (without buffer)
- IC module output counter
- Locked production cabinet
- ETS menu-driven operator interface (as on CMT 6560)
- Spooling systems TS 1150/I, /O
Mühlbauer Group
Josef-Mühlbauer-Platz 1
93426 Roding Germany
Phone: +49 9461 952 0
Fax: +49 9461 952 1101
