We use cookies to personalize content and ads, to provide social media features and to analyze traffic on our site. We also share information about your use of our website with our social media, advertising and analytics partners. Our partners may merge these updates with other information that you provided to them or that they collected as a part of you using their services. If you continue to use this website, you automatically accept our cookies.”
I agree Tell me more


Pièces de précision

Équipement de production

Solutions pour gouvernements






Combined Milling & Implanting

This process step combines two essentials of smart card production in one system. Cavities, which are dimensioned according to the size of the module to be implanted, are milled into the card bodies. The IC modules are punched out of the tape before being placed and fixed in the cavity. During the process the hot melt tape provides the adhesion of the module in the cavity while the Flexible Bump guarantees a durable connection.

Mühlbauer's Combined Milling & Implating Systems

CMI 202

  • Fully automatic cavity milling and implanting of IC Modules into plastic cards
  • Graphical based milling design programming
  • Highly accurate milling system with cooling spindle drive
  • Fast tool changing
Savoir plus sur CMI 202

CMI 5001

  • Fully automatic cavity milling and implanting of IC Modules into plastic cards
  • Suitable for contact and dual interface card production
  • Operator friendly, flexible and modular system design
  • MCES / INCAPE ready
Savoir plus sur CMI 5001