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Équipement de production

Solutions pour gouvernements

POURQUOI LE SERVICE MÜHLBAUER

MÜHLBAUER SERVICEDESK

Approvisionnement

Carrière

Contact

Combined Milling & Implanting

This process step combines two essentials of smart card production in one system. Cavities, which are dimensioned according to the size of the module to be implanted, are milled into the card bodies. The IC modules are punched out of the tape before being placed and fixed in the cavity. During the process the hot melt tape provides the adhesion of the module in the cavity while the Flexible Bump guarantees a durable connection.

Mühlbauer's Combined Milling & Implating Systems

CMI 202

  • Fully automatic cavity milling and implanting of IC Modules into plastic cards
  • Graphical based milling design programming
  • Highly accurate milling system with cooling spindle drive
  • Fast tool changing
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CMI 5001

  • Fully automatic cavity milling and implanting of IC Modules into plastic cards
  • Suitable for contact and dual interface card production
  • Operator friendly, flexible and modular system design
  • MCES / INCAPE ready
Savoir plus sur CMI 5001