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POURQUOI LE SERVICE MÜHLBAUER

MÜHLBAUER SERVICEDESK

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Carrière

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Glue Tape Lamination

Glue tape lamination is the preparation of the module tapes for the hot melt process. IC Modules are laminated on the back side with an adhesive tape. For dual interface card production, a small modification is necessary to free the additional two positions which are later used for the Flexible Bump connection.

Mühlbauer's Glue Tape Lamination Systems

CML 201

  • Easily accessible control electronics and pneumatics
  • Automatic spooling systems for module tape and spacer tape
  • SPS driven operation system
  • Locked production cabinet
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