CML 201
Glue Tape Lamination System
The CML 201 is a highly reliable and efficient glue tape lamination system. A standardized set-up, produced in large lots results in a very competitive price. This machine is suitable for a wide range of IC Module tapes (standard as well as dual interface). Short product changeover and highest autonomy times lead to a great cost of ownership value. Automatic spooling units as well as easy operation allow for a throughput of up to 9,000 modules / hour.
Key Features
- Easily accessible control electronics and pneumatics
- Automatic spooling systems for module tape and spacer tape
- SPS driven operation system
- Locked production cabinet
- Best process ability with heating from top and bottom for 100% bubble free glue lamination
- Sensor and mechanically controlled module tape transport to guarantee 100% accurate glue film placement
- Tool change within seconds without removal of module tape
- Highest automatic production time
- Best cost of ownership ratio
Productivity / Process Units
- Integrated spooling systems for module tape, spacer tape and glue tape
- Highly flexible solution for various IC Module applications
- 4-, 6-fold lamination and glue tape punching tools
- Dual interface module tools
- Customized tool designs on request
- Glue tape position control vision system optionally available
- Availability: Up to 95%
- Yield: Up to 99.7%
- Environment conditions: Room temperature: 23°C; +/-3°C; Humidity: 50%; +/-10%
Technical Data
- Module tape: 35 mm / super 35 mm
- Reel diameter max. 500 mm
- Module pitch: 9.5 ; 14.25 mm
- Spacer tape: 35 mm; Reel diameter max. 500 mm
- Throughput: Up to 6,000 uph (8-contact module tape); Up to 9,000 uph (6-contact module tape); In case of pressing process time of 1,500 ms
Mühlbauer Group
Josef-Mühlbauer-Platz 1
93426 Roding Germany
Phone: +49 9461 952 0
Fax: +49 9461 952 1101
